| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer substrate for securing conductivity and peelability in a high level and a method for manufacturing a transfer substrate. SOLUTION: This transfer substrate is configured to form each layer configuring laminated electronic components. A conductor surface making conductive the inside of the substrate is formed in an area where at least the layer is formed. The conductor surface is formed with a plurality of hollows, and a peeling layer is formed on the surface of the hollow. Thus, it is possible to secure the conductivity, and to improve the peelability by reducing the contact area with the layer. COPYRIGHT: (C)2005,JPO&NCIPI
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