| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method or the like of a copper film in which any organic impurity layer is less deposited, any abnormal growth of the copper film is less, and the adhesiveness to a base film is excellent. SOLUTION: A copper adhesive layer is deposited on a substrate by feeding a raw material gas consisting of an organic compound of copper (for example, copper hexafluoroacetylacetonate-trimethylvinylsilane [Cu(hfac)TMVS]) in a state in which steam is present in a treatment vessel with the substrate being placed therein. Then, the steam and the raw material gas in the treatment vessel is discharged, and a raw material gas is fed again in the treatment vessel to deposit a copper film on a surface of the copper adhesive layer. COPYRIGHT: (C)2008,JPO&INPIT |
