| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin electronic component package whose electronic component can be electrically connected absolutely, and a manufacturing method thereof. <P>SOLUTION: An electronic component package 10 of this invention is equipped with a core layer 11 formed by laminating three layers of a core upper layer 11a, a core intermediate layer 11b and a core lower layer 11c, each of which is formed by impregnating resin in a base material and is electrically insulating; core wiring layers 12a and 12b disposed between the insulating layers forming the core layer 11; and an electronic component 30 disposed in a cavity portion 14 formed in the core layer 11. A bonding wire 13 electrically connects the electronic component 30 and the core wiring layer 12a. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
