| 摘要 |
PROBLEM TO BE SOLVED: To improve the structural solidity and reliability of an image sensor package. SOLUTION: A sensor chip 31 is mounted by a plurality of bond wires 37 on a substrate 33 of an image sensor package 3. A sensor housing 36 having a through-hole cavity defining an optical glass (IR filter) seat 30, and defining an edge surface 361 is formed on the substrate 33 so that the sensor chip 31 can be almost surrounded. An optical glass (IR filter) 34 is formed on the optical glass seat 30. A sealing material 32 is formed to almost seal an edge surface 361 of the sensor housing 36 and a corresponding surface 331 of the substrate 33 adjacent to the edge surface 361 of the sensor housing 36. COPYRIGHT: (C)2009,JPO&INPIT
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