发明名称 CONNECTING AND BONDING ADJACENT LAYERS WITH NANOSTRUCTURES
摘要 <p>An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.</p>
申请公布号 WO2009035393(A1) 申请公布日期 2009.03.19
申请号 WO2008SE00506 申请日期 2008.09.10
申请人 SMOLTEK AB;KABIR, MOHAMMAD, SHAFIQUL;BRUD, ANDRZEJ 发明人 KABIR, MOHAMMAD, SHAFIQUL;BRUD, ANDRZEJ
分类号 B82B1/00;B82B3/00;C23C16/22;H01L21/285;H01L21/768;H01L23/52;H01L23/538 主分类号 B82B1/00
代理机构 代理人
主权项
地址