发明名称 |
CONNECTING AND BONDING ADJACENT LAYERS WITH NANOSTRUCTURES |
摘要 |
<p>An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.</p> |
申请公布号 |
WO2009035393(A1) |
申请公布日期 |
2009.03.19 |
申请号 |
WO2008SE00506 |
申请日期 |
2008.09.10 |
申请人 |
SMOLTEK AB;KABIR, MOHAMMAD, SHAFIQUL;BRUD, ANDRZEJ |
发明人 |
KABIR, MOHAMMAD, SHAFIQUL;BRUD, ANDRZEJ |
分类号 |
B82B1/00;B82B3/00;C23C16/22;H01L21/285;H01L21/768;H01L23/52;H01L23/538 |
主分类号 |
B82B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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