发明名称 WIRING BODY, CONNECTION STRUCTURE AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring body etc., which actualize a waterproof structure at low cost while flexibly adapting to design change of a wiring board. <P>SOLUTION: The wiring body 20 has FPC 21 and harness portions 25a and 25b. The FPC 21 has a wiring forming portion 21a provided with a wiring layer and an annular seal portion 21b. Both ends of the wiring forming portion 21a are enclosed with a seal portion 21b. The wiring forming portion 21a and seal portion 21b are formed integrally as one flat plate. An annular elastic packing member 23 is superposed on upper surfaces of part of the wiring forming portion 21a and the seal portion 23 which form one ring. A pair of partial housings 31a and 31b is coupled to each other with the wiring forming portion 21a and seal portion 21g, and the elastic packing member 23 interposed. The elastic packing member 23 is flexibly adaptive to change in design of the wiring board, and manufactured at low cost. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010021173(A) 申请公布日期 2010.01.28
申请号 JP20080177578 申请日期 2008.07.08
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MISHIMA HIDEHIKO;KOYAMA KEIJI
分类号 H05K7/00;G06F1/16;G06F1/18;H04M1/02 主分类号 H05K7/00
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