POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition that is excellent in dielectric properties and produces a board having high board thickness accuracy and excellent circuit filling property.SOLUTION: The polyphenylene resin composition contains (A) a modified polyphenylene ether copolymer produced by modifying a phenolic hydroxyl group at a molecular terminal of a polyphenylene ether copolymer with a compound having a carbon-carbon unsaturated double bond, (B) a polymer having a weight average molecular weight larger than that of the modified polyphenylene ether copolymer (A), having at least one structure selected from (I) polystyrene skeleton, (II) a polybutadiene skeleton and (III) a (meth) acrylate skeleton and having a softening point of 110°C or lower and (C) a compound having two or more carbon-carbon unsaturated double bonds in one molecule, having a melting point of 30°C or lower and being compatible with the modified polyphenylene ether copolymer (A).SELECTED DRAWING: None