发明名称 Wafer spin chuck and an etcher using the same
摘要 A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.
申请公布号 US8211269(B2) 申请公布日期 2012.07.03
申请号 US201113190041 申请日期 2011.07.25
申请人 PARK JOO-JIB;KIM WOO-YOUNG;LEE WOO-SEOK;SEMES CO., LTD. 发明人 PARK JOO-JIB;KIM WOO-YOUNG;LEE WOO-SEOK
分类号 H01L21/30 主分类号 H01L21/30
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