发明名称 |
DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESS |
摘要 |
The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a sapphire substrate. The composition contains a diamond abrasive and a pH adjuster. The method involves contacting the substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate. |
申请公布号 |
WO2016168231(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
WO2016US27189 |
申请日期 |
2016.04.13 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
PANDEY, Prativa;REISS, Brian;WHITE, Michael |
分类号 |
H01L21/304;B24B37/24 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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