| 发明名称 |
WAFER FOR ELECTRICAL CONNECTOR |
| 摘要 |
A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals. |
| 申请公布号 |
US2016322760(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201615140672 |
申请日期 |
2016.04.28 |
| 申请人 |
Molex, LLC |
发明人 |
Long Jerry A.;Deichmann Eric A.;Tillotson Daniel;Flynn Michael P.;Hoyt Justin;Mendoza Jerber |
| 分类号 |
H01R13/6587;H01R43/04;H01R12/71 |
主分类号 |
H01R13/6587 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer comprising:
a lead frame, the lead frame including a plurality of signal terminals and a plurality of ground terminals, the ground terminals having a body portion, a mounting portion disposed at a first end of the body portion and a connection portion disposed at a second end of the body portion, the ground terminal including an opening formed in the body portion with the opening including opposing edges; and a shield disposed on a side of the lead frame, a projection extending from the shield, the projection having a pair of side portions that engage the edges of the opening in the ground terminal. |
| 地址 |
Lisle IL US |
