| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of, in a power conversion device assembled when card type power semiconductor modules are inserted into a slotted casing, facilitating mounting/dismounting of the individual power semiconductor modules.SOLUTION: The power conversion device disclosed includes: the casing having a plurality of slots on a front side and having a high current bus line and a small signal circuit board on a back side; and a plurality of card type modules inserted in corresponding slots. In the power conversion device, at least one of the plurality of card type modules is a power semiconductor module. In the power conversion device, in the back of the slots, the card type modules are electrically connected to the high current bus line and the card type modules are electrically connected to the small signal circuit board. |
