| 摘要 |
PROBLEM TO BE SOLVED: To improve strength and heat resistance of bonding metal for bonding a terminal electrode of an electronic component and a terminal electrode of a circuit board which are included in an electronic circuit module component to each other, and to improve a self-alignment function of the electronic component.SOLUTION: An electronic circuit module component includes an electronic component 2, a circuit board 3 mounted with the electronic component 2, where bonding metal 10 which is interposed between a terminal electrode 2T of the electronic component 2 and a terminal electrode 3T of the circuit board 3 to bond them together. In the bonding metal 10, a volume fraction of a Ni-Fe alloy phase in a first region 10E1 is greater than that of the Ni-Fe alloy phase in a second region 10E2, and a volume fraction of a Sn alloy phase in the second region 10E2 is greater than that of the Sn alloy phase in the first region 10E1. |
