| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for an electronic component in which production efficiency can be enhanced, and to provide its manufacturing method. <P>SOLUTION: A flexible circuit board 20 and a current collection board 40 are prepared, a hole 21 for press fitting the current collection board 40 is formed in the flexible circuit board 20, a tubular protrusion 42 formed on the current collection board 40 is press fitted in the hole 21 formed in the flexible circuit board 20 in order to integrate the flexible circuit board 20 and the current collection board 40, the flexible circuit board 20 and the current collection board 40 thus integrated are fixed in first and second dies 310 and 330, the cavity C1 of the first and second dies 310 and 330 is filled with molten molding resin which is taken out after solidification, thus manufacturing a substrate 60 for an electronic component. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
