| 摘要 |
PROBLEM TO BE SOLVED: To provide a pickup device for a semiconductor chip by which a semiconductor chip is picked up by peeling from an adhesive sheet easily and surely without causing damage even for a semiconductor chip having a special structure. SOLUTION: A knocking-up drive device 17 is driven to knock up the semiconductor chip 15 via the adhesive sheet 16 with a knocking-up member 11. At this point, a spherical tip 11a in the knocking-up member 11 contacts with a peripheral lower end or an inner side wall surface in an opening 15a of a backside of the semiconductor chip 15, and does not contact with a wafer at the upper part of a recess 15b. Then a vacuum device 13 is operated to generate a vacuum condition between the adhesive sheet 16 and a pickup stage 12, the adhesive sheet 16 is vacuum-chucked from a suction channel 14 in the pickup stage 12 on the periphery of the knocking-up member 11, and the adhesive sheet 16 is peeled from the semiconductor chip 15 by pulling an opposite surface of the adhesive surface of the semiconductor chip 15 in the adhesive sheet 16. COPYRIGHT: (C)2007,JPO&INPIT |
