| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a measuring device capable of surely measuring the height of an upper face and thickness of a workpiece, such as a semiconductor wafer held in a chuck table, and to provide a laser processing machine having the measuring device. <P>SOLUTION: The measuring device for measuring the height of the workpiece held in the chuck table holding the workpiece includes a white color light source; a first pinhole mask for passing light of wavelength of a part of diffraction light branching white color light by an acoustic optical modification means; a color aberration lens for irradiating the workpiece, by condensing light passing the first pinhole mask; a beam splitter for deflecting the reflected light of a light irradiated on the workpiece; a second pinhole mask for passing the reflected light deflected by the beam splitter; a light-receiving element for outputting a light-receiving signal of the reflected light passing the second pinhole mask; and a control means for obtaining the height position of the workpiece, based on a control signal of the acoustic optical deflection means and the light-receiving signal from the light-receiving element. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
