发明名称 FILMING METHOD FOR III-GROUP NITRIDE SEMICONDUCTOR LAMINATED STRUCTURE
摘要 Provided is a method for filming such a multilayer film structure over a substrate as is made of a stable, excellently crystalline III-group nitride semiconductor. The multilayer film structure includes at least a buffer layer and a substrate layer from a substrate side, and the buffer layer and the substrate layer are filmed by the sputtering method. The filming temperature of the buffer layer is lower than that of the substrate layer, or the film thickness of the buffer layer is 5 nm to 500 nm. Moreover, the multilayer film structure includes at least the substrate layer and a light emitting layer from the substrate side. The method comprises the step of filming the substrate layer by the sputtering method and the light emitting layer by the metal organic chemical vapor deposition method (or the MOCVD method).
申请公布号 KR20090040357(A) 申请公布日期 2009.04.23
申请号 KR20097004225 申请日期 2009.02.27
申请人 SHOWA DENKO K.K. 发明人 MIKI HISAYUKI;HANAWA KENZO;SASAKI YASUMASA
分类号 C23C14/34;C23C14/06;H01L21/203;H01L21/205;H01L33/00 主分类号 C23C14/34
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