PLASMA PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus, which achieves uniformity of cooling gas pressure around a through-hole of a sample stage, and which prevents the generation of a temperature difference between a pusher pin and the sample stage. SOLUTION: The vacuum processing apparatus includes: a vacuum processing chamber; a high-frequency power supply for plasma generation; a sample stage on which a workpiece is placed and which includes a cooling medium passage for controlling a temperature of the workpiece; an electrostatic adsorption power supply for electrostatically adsorbing the workpiece onto the sample stage; a means for supplying a gas for controlling the temperature of the workpiece between the workpiece and the sample stage; and a pusher pin disposed in the through-hole provided on the sample stage for vertically moving the workpiece; wherein the pusher pin is configured to close the through-hole and to obtain excellent heat transfer by being brought into tight contact with the sample stage during processing of the workpiece. COPYRIGHT: (C)2010,JPO&INPIT