| 摘要 |
PROBLEM TO BE SOLVED: To provide a scratch detection device of a wafer, and also to provide a grinding device equipped with the same. SOLUTION: The grinding device is provided with a chuck table for holding the wafer and a grinding means having a grinding wheel for grinding the wafer held at the chuck table. The grinding device is further provided with a scratch detection means for detecting a scratch caused on the grinding face of the wafer. The scratch detection means includes a light beam irradiating means for irradiating light beam to the wafer, a converging means for converging a reflective light from an area where the light beam is irradiated, a light receiving means for receiving the reflective light which is converged by the converging means, and a determining means for determining the existence of the scratch when a light amount detected by the light receiving means exceeds a predetermined threshold value. The light receiving means is configured to be a shape to follow a direction where the scratch is formed. COPYRIGHT: (C)2010,JPO&INPIT |
