| 发明名称 |
Shielding MEMS structures during wafer dicing |
| 摘要 |
A MEMS wafer (46) includes a front side (52) having a plurality of MEMS structure sites (60) at which MEMS structures (50) are located. A method (40) for protecting the MEMS structures (50) includes applying (44) a non-active feature (66) on the front side of the MEMS wafer in a region that is devoid of the MEMS structures and mounting (76) the front side of the MEMS wafer in a dicing frame (86) such that a back side (74) of the MEMS wafer is exposed. The MEMS wafer is then diced (102) from the back side into a plurality of MEMS dies (48). |
| 申请公布号 |
US9346671(B2) |
申请公布日期 |
2016.05.24 |
| 申请号 |
US201414172479 |
申请日期 |
2014.02.04 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Magnus Alan J.;Dawson Chad S.;Hooper Stephen R. |
| 分类号 |
B81B7/00;B81C1/00;H01L21/683 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
Jacobsen Charlene R. |
| 主权项 |
1. A method for protecting microelectromechanical systems (MEMS) structures on a MEMS wafer, said MEMS wafer including a front side having a plurality of MEMS structure sites at which said MEMS structures are located, and said method comprising:
applying a non-active feature on said front side of said MEMS wafer at a region of said MEMS wafer that is devoid of said MEMS structures, wherein said non-active feature comprises a nitride film; mounting said front side of said MEMS wafer in a dicing frame such that a back side of said MEMS wafer is exposed; and dicing said MEMS wafer from said back side into a plurality of MEMS dies. |
| 地址 |
Austin TX US |
