| 发明名称 |
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME |
| 摘要 |
A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads. |
| 申请公布号 |
US2016162091(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201615040190 |
申请日期 |
2016.02.10 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HA JEONG-KYU;LEE KWAN-JAi;JUNG JAE-MIN;CHO KYONG-SOON;SHIN NA-RAE;YANG KYOUNG-SUK;LEE PA-LAN;LIM SO-YOUNG |
| 分类号 |
G06F3/041;G06F1/16 |
主分类号 |
G06F3/041 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip on film package, comprising:
a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein; a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the through hole; and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads. |
| 地址 |
SUWON-SI KR |
