Prediction Based Chucking and Lithography Control Optimization

摘要

Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

主权项

1. A method, comprising:
obtaining wafer geometry measurements of a wafer prior to the wafer being chucked by a chucking device; calculating distortions of the wafer predicted to occur when the wafer is chucked by the chucking device, wherein the predicted distortions of the wafer are calculated at least partially based on the wafer geometry measurements and a mechanics model of the chucking device; and determining whether to adjust a chucking parameter of the chucking device at least partially based on the predicted distortions of the wafer.