发明名称 CONDUCTIVE ADHESIVE AND ELECTRONIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a conductive adhesive having excellent conduction reliability regardless of the type of electrode metal.SOLUTION: A conductive adhesive has (A) conductive particle, (B) resin, and (C) organic metal compound, where the (C) organic metal compound is salt or chelate of (C1) metal with standard electrode potential of -0.25 V or less and (C2) organic compound having one or more carboxyl group in one molecule.SELECTED DRAWING: None
申请公布号 JP2016183270(A) 申请公布日期 2016.10.20
申请号 JP20150064565 申请日期 2015.03.26
申请人 TAMURA SEISAKUSHO CO LTD 发明人 HAYASHIDA YOSHITAKA
分类号 C09J9/02;C09J201/00;H01B1/22;H05K3/32 主分类号 C09J9/02
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