| 发明名称 | Substrate treating apparatus and method | ||
| 摘要 | Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line. | ||
| 申请公布号 | US9506695(B2) | 申请公布日期 | 2016.11.29 |
| 申请号 | US201414556334 | 申请日期 | 2014.12.01 |
| 申请人 | SEMES CO., LTD. | 发明人 | Kim Ki-Bong;Kim Seong-Soo;Kim Woo-Young |
| 分类号 | F26B21/00;H01L21/67 | 主分类号 | F26B21/00 |
| 代理机构 | Carter, DeLuca, Farrell & Schmidt, LLP | 代理人 | Carter, DeLuca, Farrell & Schmidt, LLP |
| 主权项 | 1. A substrate treating apparatus comprising: a first unit; a second unit; a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit; a flow rate adjustment member disposed in the supply line; and a filter disposed in the supply line to remove foreign substances, wherein the supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line, wherein the flow rate adjustment member comprises an orifice, and wherein the supply line disposed between the orifice and the filter has a length greater than a length of the supply line disposed between the filter and the second unit. | ||
| 地址 | Chungcheongnam-do KR | ||