SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device which can improve the adhesion between its semiconductor chip and substrate. The semiconductor device (60) is provided with the semiconductor chip (18), a die pad (metallic section) (16) which supports the chip (18) stuck to the pad (16) with an adhesive layer (62), and a sealing resin (24) for sealing the pad (16) and the chip (18) and, in the adhesive layer (62), pluralities of conductive adhesive areas (66) and insulating adhesive areas (64) mixedly coexist.