发明名称 Process solutions containing surfactants
摘要 Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.
申请公布号 US8227395(B2) 申请公布日期 2012.07.24
申请号 US20100846369 申请日期 2010.07.29
申请人 ZHANG PENG;CURZI DANIELLE MEGAN KING;KARWACKI, JR. EUGENE JOSEPH;BARBER LESLIE COX;AIR PRODUCTS AND CHEMICALS, INC. 发明人 ZHANG PENG;CURZI DANIELLE MEGAN KING;KARWACKI, JR. EUGENE JOSEPH;BARBER LESLIE COX
分类号 C11D1/00;G03F7/004;G03F7/09;G03F7/16;G03F7/30;G03F7/32;G03F7/38;G03F7/40;G03F7/42;H01L21/027;H01L21/304 主分类号 C11D1/00
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