SUB-MOUNT FOR USE IN FLIP-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME,申请号KR20030092448-传众专利搜索

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发明名称	SUB-MOUNT FOR USE IN FLIP-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
摘要
申请公布号	KR20050060741(A)	申请公布日期	2005.06.22
申请号	KR20030092448	申请日期	2003.12.17
申请人	LG ELECTRONICS INC.	发明人	KIM, SUN HO;SONG, KI CHANG;KIM, GEUN HO
分类号	H01L23/50;(IPC1-7):H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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