发明名称 |
PROTECTIVE SHEET FOR SEMICONDUCTOR, SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a protective sheet for a semiconductor that can prevent a wafer from being broken owing to expansion of stagnant air under a vacuum, even if the stagnant air is contained when the protective sheet is stuck on the semiconductor wafer. SOLUTION: The protective sheet for the semiconductor comprises a base material and an adhesive layer formed on its one surface, and a through-hole is formed as penetrating the sheet from one surface to the other surface. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006344932(A) |
申请公布日期 |
2006.12.21 |
申请号 |
JP20060113394 |
申请日期 |
2006.04.17 |
申请人 |
LINTEC CORP |
发明人 |
HORIGOME KATSUHIKO;WAKAYAMA YOJI;TOMINO TADAHIRO;KOIKE HIROSHI;TSUDA KAZUHISA |
分类号 |
H01L21/304;C09J7/02;H01L21/683 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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