| 摘要 |
A semiconductor device capable of dissipating heat with a high degree of efficiency without impairing the strength thereof is provided. The semiconductor device includes a semiconductor chip 2 , a heatsink plate 1 overlapping a rear face of the semiconductor chip 2 , and an adhesive 4 for adhesively fixing the semiconductor chip 2 and the heatsink plate 1 to each other. In the rear face of the semiconductor chip 2 , there is formed a depressed portion 7 right under a heat generating portion 6 of the semiconductor chip 2 . On the front face of the heatsink plate 1 , there is formed a protruding portion 8 that is to fit in the depressed portion 7.
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