发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide satisfactorily dry a substrate surface while preventing the generation of fall of a pattern formed on the substrate surface in a substrate processing apparatus and a substrate processing method for drying the substrate surface wetted with a liquid using steam of an organic solvent such as IPA (isopropyl alcohol). SOLUTION: After rinse processing, a bottom surface 43 as a substrate facing surface of a facing member 4 formed of a porous material is disposed with a space while facing a rinse solution adhering on a substrate surface Wf. Then, an organic solvent gas containing steam of an organic solvent dissolved in the rinse solution and reducing surface tension is supplied to the substantial center portion of a top surface 41 of the facing member 4. The organic solvent gas supplied to the facing member 4 spreads inside the facing member 4 while dispersing, and is uniformly discharged from the entire bottom surface 43 of the facing member 4 toward the rinse solution adhering on the substrate surface Wf. In this way, the organic solvent is uniformly dissolved in each part of the rinse solution, and the surface tension is uniformly lowered. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028068(A) 申请公布日期 2008.02.07
申请号 JP20060197778 申请日期 2006.07.20
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MIYA KATSUHIKO
分类号 H01L21/304 主分类号 H01L21/304
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