发明名称 ELECTRONIC PART PROTECTING SHEET AND COATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic protecting sheet by which an electronic part and an electronic substrate with the electronic part mounted thereto are coated, and to provide its coating method. SOLUTION: The electronic part protecting sheet is formed by laminating (a) an element having thermal expansion, and (b) another element that has thermal melting property and loses it when it is given by light. Preferably, the thermal melting temperature of the element (a) is higher by 20°C than that of the element (b). The coating method is used to coat the electronic part by the electronic part protection sheet; and it includes a step of bringing the electronic part protection sheet into contact with a part to be protected, a step of heating a substrate at a temperature where the element (a) exhibits thermal expansion and the element (b) is melted by heating and to make the substrate uneven, and a step of emitting light. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027973(A) 申请公布日期 2008.02.07
申请号 JP20060195596 申请日期 2006.07.18
申请人 THREE BOND CO LTD 发明人 KIMURA HIROSHI
分类号 H05K3/28;H01L23/29;H01L23/31 主分类号 H05K3/28
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