发明名称 DOUBLE-SIDE POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a double-side polishing device on which one of two sets of pairs of upper and lower ring type adjusting mechanisms to restrain warpage of a carrier end part is arranged on the outside of a central gear of a double-side polishing device and the other is arranged on the inside of an internal gear so that both of them hold the carrier end part. <P>SOLUTION: This double-side polishing device 3 to carry out polishing work while supplying an abrasive while vertically pushing a upper surface plate 7 and a lower surface plate 6 on a working object 1 stored in a hole of a carrier has the two sets of the pairs of the upper and lower ring type adjusting mechanisms 9, 10 engaged with both of the central gear 4 and the internal gear 5 of the double-side polishing device and to restrain warpage of the carrier end part 8 rotating while pushed by the upper surface plate on the lower surface plate, and one of them is arranged on the outside of the central gear of the double-side polishing device and the other is arranged on the inside of the internal gear so that both of them hold the carrier end part. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008161993(A) 申请公布日期 2008.07.17
申请号 JP20060356250 申请日期 2006.12.28
申请人 KYOCERA KINSEKI CORP 发明人 TAKAHASHI ATSUYA;IIDA HIROAKI
分类号 B24B37/08;B24B37/27;B24B37/28;H01L21/304 主分类号 B24B37/08
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