发明名称 CURABLE RESIN COMPOSITION AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition which contains as the base polymer a silicone-based curable resin having a polyoxyalkylene structure in the main chain, excels in adhesion to ABS resins, and to provide a moisture-cure type adhesive composition. SOLUTION: The curable resin composition contains, as the constituent elements of the polymer, at least a silicone-based curable resin (A) which has an oxyalkylene polymer as the main chain and has a crosslinkable reactive silicon group in the molecule and a vinyl compound (b1) having a cyclic amide functional group, and further contains an organic polymer (B) having a crosslinkable reactive silicon group in the molecule. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010018661(A) 申请公布日期 2010.01.28
申请号 JP20080178647 申请日期 2008.07.09
申请人 KONISHI CO LTD 发明人 NOMURA YUKIHIRO;SATO SHINICHI
分类号 C08L71/02;C08F2/44;C08F283/06;C08L57/12 主分类号 C08L71/02
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