SOLDER-CREEP MANAGEMENT IN HIGH-POWER LASER DEVICES

摘要

In various embodiments, laser apparatuses include thermal bonding layers between various components and creep-mitigation systems for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.

主权项

1. A laser apparatus comprising:
a beam emitter having first and second opposed surfaces; a first electrode mount disposed beneath and in thermal contact with the first surface of the beam emitter; a thermally conductive housing body disposed beneath the first electrode mount; a thermal bonding layer disposed between the first electrode mount and the housing body, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the housing body, and (ii) comprising a thermal bonding material; and a creep-mitigation system for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer.