发明名称 MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICS
摘要 Heat spreading device using microfabricated microfluidic structures to cool microelectronic devices.
申请公布号 US2016218048(A1) 申请公布日期 2016.07.28
申请号 US201615006535 申请日期 2016.01.26
申请人 Nuvotronics Inc. 发明人 Kazemi Hooman;Crawford Mark;Caba Aaron;Sherrer David
分类号 H01L23/473 主分类号 H01L23/473
代理机构 代理人
主权项 1. A thermal spreader, comprising a surface for mounting to a device to be cooled or heated, and a plurality of microstructures in thermal communication with the surface, a selected pair of the microstructures having a passageway extending therebetween, the passageway comprising a flow disruptor disposed therein to increase heat transfer therein.
地址 Radford VA US