发明名称 |
RESIN COMPOSITION AND USES THEREOF IN HIGH-FREQUENCY CIRCUIT BOARD |
摘要 |
The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments. |
申请公布号 |
EP3056544(A1) |
申请公布日期 |
2016.08.17 |
申请号 |
EP20140891459 |
申请日期 |
2014.08.11 |
申请人 |
SHENGYI TECHNOLOGY CO. LTD. |
发明人 |
CHEN, GUANGBING;ZENG, XIANPING |
分类号 |
C08L71/12;B32B15/08;B32B27/04;C08J5/24;C08L83/07;H05K1/03 |
主分类号 |
C08L71/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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