发明名称 |
DETECTING METHOD FOR IMPROVING RESOLUTION OF AREA ARRAY PROBE |
摘要 |
The invention provides a detecting method for improving a resolution ratio of an area array probe. The detecting method comprises the following steps: firstly, an ultrasonic area array probe is provided with N wafers that are arranged in the form of an area array; secondly, controlling a wafer a to send m impulse waves toward a to-be-detected workpiece through a chip; thirdly, successively respectively receiving the impulse waves reflected by the to-be-detected workpiece through a wafer and adjacent (m−1) wafers of the wafer; fourthly, when the N chips all send the m impulse waves, and fully receiving the impulse waves reflected by the to-be-detected workpiece; fifthly, repeating the previous four steps until flaw detection is finished; and lastly, obtaining a defect diagram of the to-be-detected workpiece by analytical processing of the impulse waves received by a main engine, displaying through a displayer arranged on the main engine. |
申请公布号 |
US2016238569(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201515026568 |
申请日期 |
2015.03.20 |
申请人 |
NDT TECHNOLOGY (SHANGHAI) CO., LTD |
发明人 |
ZHANG Rui |
分类号 |
G01N29/44;G01N29/04 |
主分类号 |
G01N29/44 |
代理机构 |
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代理人 |
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主权项 |
1. A detection method capable of improving a resolution of an area array probe, comprising the following steps: step 1, an ultrasonic area array probe is provided with N wafers that are arranged in the form of an area array, wherein N represents the number of the wafers;
step 2, a chip controls a wafer a to emit impulse waves to a workpiece to be detected for m times, wherein a represents the ath wafer and m represents the times of emitting impulses; step 3, the impulse waves reflected by the workpiece to be detected are successively received by the wafer a and (m−1) wafers adjacent to the wafer a, respectively; step 4, all the N wafers emit impulse waves for m times successively, and the impulse waves reflected by the workpiece to be detected are received; step 5, the process of the step 1 to the step 4 is repeated until defect detection is finished; and step 6, a host analytically processes the received impulse waves to obtain a defect graph of the workpiece to be detected, and the defect graph is displayed through a display of the host. |
地址 |
Shanghai CN |