HEATING ELEMENT FOR SMD MOUNTING, ELECTRONIC ASSEMBLY HAVING SUCH A HEATING ELEMENT, AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY

摘要

The invention relates to a heating element (17) having a mounting side (31) for SMD mounting on a circuit carrier (11). Additionally, the invention relates to an electronic assembly having a printed circuit board (11) on which the heating elements (17) are mounted. The invention provides for the heating elements to have a housing (19) in which a reactive substance (33) is provided. A likewise claimed method for manufacturing the electronic assembly involves the heating elements being used, according to the invention, to react at a reaction temperature that is below the joining temperature for the solder joints (28). This advantageously allows the process temperatures in a soldering furnace, in which soldering is performed, to be lowered and the cycle times for the electronic assembly to be reduced. The resultant lack of heat input is provided by the heating elements. In particular, heating elements can also be used to compensate for uneven heating of the electronic assembly in the soldering furnace.