| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a wafer, capable of enabling a street-reduction, simplifying steps, and surely breaking an adhesive sheet.SOLUTION: A method comprises: a modified layer forming step of forming a modified layer along a predetermined division line by irradiating a wafer 11 with a laser beam that penetrates the wafer 11; a protective member arranging step of arranging the protective member on a surface of the wafer 11; a grinding step of grinding a rear surface of the wafer 11 to thin the wafer to a predetermined thickness and dividing the modified layer into individual chips 27 at a division starting point; a sheet adhering step of adhering an adhesive sheet 29 that is cured by the irradiation with ultraviolet to the rear surface of the wafer 11, adhering a pressure sensitive adhesive sheet T on the adhesive sheet and removing the protective member arranged on the surface; an ultraviolet irradiating step of irradiating with the ultraviolet to cure and break the adhesive sheet 29 to break the wafer along the chips; and a pick-up step of picking up individual chips in which the adhesive sheet 29 is adhered to its rear surface from the place above the pressure sensitive adhesive sheet T. |
