发明名称 |
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING |
摘要 |
A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced. |
申请公布号 |
WO2016209339(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
WO2016US28338 |
申请日期 |
2016.04.20 |
申请人 |
RAYTHEON COMPANY |
发明人 |
DIEP, Buu Q.;KENNEDY, Adam M.;KOCIAN, Thomas Allan;LAMB, Mark |
分类号 |
B81C1/00;B81B7/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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