| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for diffusing the heat in a fluid ejector cartridge, and a method using it. SOLUTION: A manifold molded from a polymer having at least one heat conductive filler material is used for cooling a fluid ejector head assembly. The manifold and a fluid ejector die module are made of materials same in the coefficient of thermal expansion, and the manifold and a container are integrally molded on a single member. At least one filler material is oriented in almost parallel to the oriented flow region of the fluid ejector die module. COPYRIGHT: (C)2005,JPO&NCIPI
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