发明名称 MOLD FOR MOLDING RESIN AND METHOD FOR EJECTING MOLD COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a resin and a method for ejecting a mold component which enable the ejection of a mold component by a simple structure. SOLUTION: The method comprises a mold for molding a resin 3 by which a fluid resin is cured and a cured resin 14 is formed after a resin filling section including a cavity 9 is filled up with a fluid resin and which is used when completing a mold component 15 including the cured resin 14 and a product, a fixed block 4 which composes a fixed surface 10 fixed to the mold component 15 among molding surfaces which can touch the mold component 15, a movable surface 11 which consists of members other than the fixed surface 10 among the molding surfaces, a pair of movable blocks 7 prepared to freely pivot correspondingly respectively along corresponding ends in the cavity 9, and a turning means which turns each of movable blocks 7. Each of movable blocks 7 turns after the cured resin 14 is formed, thereby force is applied to mold component 15 on the movable surface 11. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006224605(A) 申请公布日期 2006.08.31
申请号 JP20050044031 申请日期 2005.02.21
申请人 TOWA CORP 发明人 MAEDA KEIJI
分类号 B29C33/44;B29C45/40 主分类号 B29C33/44
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