| 摘要 |
PROBLEM TO BE SOLVED: To realize temperature lowering and cost reduction of a heater board process in a CR manufacturing method. SOLUTION: Temperature lowering of the heater board process is attempted by using plasma CVD SiN and SiON films as an etching stopping layer. In this case, the composition, stress and the like of this plasma CVD film are regulated. COPYRIGHT: (C)2006,JPO&NCIPI
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