| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness between a blank and a base electrode layer in a chip coil. SOLUTION: The chip coil has the blank 7, a coil pattern 8 formed in contact with the blank 7, an electrode 9 connected to the coil pattern 8 and provided on the surface of the blank 7, and the base electrode layer 12 provided on a contact portion between the coil pattern 8 and the blank 7. The base electrode layer 12 has a copper mass and a nickel mass, and at least the nickel mass out of the copper mass and the nickel mass enters a recess on the surface of the blank 7. COPYRIGHT: (C)2007,JPO&INPIT
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