发明名称 COOLING STRUCTURE OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve a problem wherein, in a case where a thermally-conductive sheet is fixed by being sandwiched between a heating element chassis and a radiator, when the radiator or the heating element chassis deforms, the contact state of the thermally-conductive sheet is degraded at a part distant from a screw fixation point, and heat transfer performance is degraded. SOLUTION: By using a material having a low linear expansion coefficient for the heating element chassis, and using a cooling structure covering the radiator, adhesiveness of the radiator to the heating element chassis is increased in response to heat generation of a heating element by utilizing the difference between the linear expansion coefficients of the heating element chassis and the radiator, and the contact state to the thermally-conductive sheet is improved, whereby heat transfer performance can be improved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311505(A) 申请公布日期 2008.12.25
申请号 JP20070158937 申请日期 2007.06.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 IWASAKI KENICHI
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
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