| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive composition capable of obtaining a conductive film having low resistivity even when heat treatment is performed at a low temperature of, for example, 150°C or below. <P>SOLUTION: A conductive composition includes a silver fine particles, a silver resinate, a binder resin and a solvent, and a ratio of the silver resinate to the silver fine particle is 0.2 to 1.6 wt.%. The silver resinate is preferably a reactant of a silver salt of a carboxylic acid and a mercaptan. The silver resinate is more preferably a reactant of a silver salt of a carboxylic acid and t-dodecyl mercaptan. <P>COPYRIGHT: (C)2012,JPO&INPIT |
