| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can create its wiring pattern on its resin-based board at a low cost without using nano-order metal grains and without requiring high-temperature heating, and to provide a manufacturing method of the wiring board. Ž<P>SOLUTION: Conductive paste obtained by distributing conductive grains 4 into a binder 5 is prepared. Polyester-based resin is used as a material of the binder 5. Ag grains having micron-order grain sizes are used as materials of the conductive grains 4. The blending ratio of the polyester-based resin to the Ag grains is selected so as to be 2 to 40 pts.wt. Then, the conductive paste is applied to the surface of a basic board 2 so as to create a desired wiring pattern, and the paste is pressed by a pressing roller 21. Thereafter, the paste is heated at a temperature not higher than 150°C. Thereby, the wiring board with its basic board 2 and its wiring pattern adhered to each other strongly is manufactured. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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