HIGH-STABILITY POLYURETHANE POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates.SOLUTION: A polishing pad comprises: a cast polyurethane polymeric matrix formed from an isocyanate-terminated molecule and a curative agent. The cast polyurethane polymeric matrix contains 4.2-7.5 weight percent fluid-filled microspheres in the isocyanate-terminated molecule. The fluid-filled-microspheres are polymeric and have an average diameter of 10-80 μm. The polishing pad has a conditioner sensitivity (CS) of 0-2.6.SELECTED DRAWING: None