发明名称 |
SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE |
摘要 |
The embodiment of a substrate treatment device includes a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed, a transport section configured to transport the treatment object, a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object.
the treatment object is at least one of:a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate,the device substrate with the adhesive attached thereto, andthe support substrate with the adhesive attached thereto. |
申请公布号 |
US2016225613(A1) |
申请公布日期 |
2016.08.04 |
申请号 |
US201415021182 |
申请日期 |
2014.09.24 |
申请人 |
SHIBAURA MECHATRONICS CORPORATION |
发明人 |
Kanai Takahiro;Matsui Emi;Hayashi Konosuke |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate treatment device comprising:
a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed; a transport section configured to transport the treatment object; and a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object, the treatment object being at least one of:
a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate,the device substrate with the adhesive attached thereto, andthe support substrate with the adhesive attached thereto. |
地址 |
Yokohama-shi, Kanagawa-ken JP |