发明名称 HEAT TRANSFER DEVICE AND METHOD OF MAKING THE SAME
摘要 A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.
申请公布号 US2016238331(A1) 申请公布日期 2016.08.18
申请号 US201615044601 申请日期 2016.02.16
申请人 HonMounTech Co., Ltd. 发明人 LIANG Yi-Fan
分类号 F28F21/02;B32B37/10;B32B37/12;F28F21/04;F28F21/08 主分类号 F28F21/02
代理机构 代理人
主权项 1. A heat transfer device, comprising: a first substrate including a first plate and a first adhesive layer that is formed on said first plate; a second substrate including a second plate and a second adhesive layer that is formed on said second plate; and a heat transfer layer sandwiched between said first and second adhesive layers and including a plurality of carbon flakes that are made from a material selected from the group consisting of graphite, graphene, and the combination thereof, wherein each of said carbon flakes lies on said first adhesive layer with partial overlap of said carbon flakes.
地址 Taipei City TW