SURFACE MOUNTED STANDOFF LIGHT EMITTING DIODE DEVICE

摘要

This application discloses a standoff device for surface-mounting light emitting diodes (LEDs). In some embodiments, the standoff has asymmetric features to control orientation of a part in tube or reel packaging. The standoff has a broad base to keep the part upright during the reflow process. The standoff has a lifted bottom surface to allow room for solder flowing onto leads. The standoff has lead holes spaced at a standard distance to hold many different LEDs. In addition, the standoff has a variable height designed to allow one mold to make parts of different heights.

主权项

1. A standoff device for surface-mounting light-emitting diodes (LEDs) above a printed circuit board (PCB), comprising:
an integration component that receives one or more LEDs; and a base component that is connected to a bottom of the integration component and in contact with the PCB, wherein the standoff device is made of heat-resistant, moldable material, wherein the standoff device contains two or more slots for wire frames of the one or more LEDs, wherein the slots run through the integration component and the base component, wherein the slots associated with the same LED have different shapes or sizes, and wherein the base component includes a lifted bottom that allows solder flowing onto the wire frames during a reflow soldering process for surface-mounting the LED to the PCB.